About the introduction of Alumina Ceramic Substrate

About the introduction of Alumina Ceramic Substrate

Alumina ceramic substrate is also called alumina ceramic circuit board. The raw material is alumina ceramic substrate (alumina green ceramic sheet). These substrates are processed, such as copper cladding and other metallization, etching, gold immersion, gold plating and other surface treatments.To form ceramic circuit boards with good electrical properties, ceramic copper clad laminates are used as heat dissipation substrates in many fields.

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Independent production of high-purity alumina powder for more than 20 years, mastering the upstream supply of powder


Sophisticated production technology and production equipment ensure high product quality and high cost performance


First-class technical team can provide customers with one-stop professional solutions in the design process


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Zhejiang Weilan Hangdun Precision Ceramic Technology Co., Ltd. is an advanced ceramic manufacturer specializing in production, research and development and sales in China. The company has a well-trained professional technical team with core technologies of precision ceramics such as ceramic substrates, structural ceramics and functional ceramics. Committed to the development and sales of high-quality alumina, zirconia, aluminum nitride and silicon nitride and other advanced ceramics, including ceramic substrates, IC packaging substrates, LED packaging substrates and high-strength structural ceramics.

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High Density Alumina Ceramic Substrate


The alumina content of high-density alumina ceramic substrates is generally between 96% and 99.6%, and these materials are known for their high corrosion and wear resistance. Furthermore, they exhibit good mechanical strength and can be used as electrical insulators. They show very low adhesion and inherently have excellent flatness. Finally, the alumina substrate exhibits good thermal conductivity. So, what are the uses of high-density alumina ceramic substrates?

1. Electronic packaging: In the process of electronic packaging, the substrate mainly plays the role of mechanical support protection and electrical interconnection (insulation). With the development of electronic packaging technology in the direction of miniaturization, high density, multi-function, and high reliability, the power density of electronic systems is increasing, and the heat dissipation problem is becoming more and more serious. There are many factors that affect the heat dissipation of the device, and the choice of substrate material is also a key link.

2. Substrates for power modules: High-strength substrates compatible with direct bonding of copper sheets are suitable for a wide range of power module applications.

3. Thick Film Substrate: Alumina ceramic substrate has excellent reliability and can be used in thick film applications.

4. Polished substrates: thin film substrates with excellent surface smoothness.

5. Thin film substrate: a thin film substrate with excellent surface smoothness.

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Alumina is the best known chemically and physically stable fine ceramic material. Thermal Properties: High heat resistance and high thermal conductivity.

Our delivery date is 30--60 days.

Adhering to the concept of providing customers with high-quality services, our company can provide customers with one-stop services such as design and professional advice, and provide customers with overall solutions!

Our company has been engaged in high-purity alumina (99.99%) for more than 20 years, mastering the core technology of alumina powder from the source, coupled with sophisticated production technology, so as to provide users with high-quality, cost-effective high-purity alumina Related Products.

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